Electronic Cooling Simulations using ANSYS ICEPAK

BY
Skill Lync

Understand the concepts of Computational Fluid Dynamics by enrolling for the Electronic Cooling Simulations using ANSYS ICEPAK course by Skill-Lync.

Mode

Online

Duration

3 Months

Quick Facts

particular details
Medium of instructions English
Mode of learning Self study
Mode of Delivery Video and Text Based

Course overview

Electronic Cooling Simulations using ANSYS ICEPAK course is being offered by Skill Lync to give the learners an opportunity to understand the concepts of computational fluid dynamics. Skill-Lync is a platform that provides industry-oriented advanced engineering courses for engineering students by collaborating with industry experts. ANSYS ICEPAK is a powerful CFD suite, which enables multi-physics coupling between thermal, electrical, and mechanical analyses for electronics design. 

It is combined with thermal–stress analysis, ANSYS Workbench for coupling with MCAD, with ANSYS Mechanical, and advanced post-processing through ANSYS CFD-Post. Through this course, participants will learn the procedure of providing effective cooling, modeling and treating the electronic systems manually on ICEPAK. 

They will gain knowledge about the ANSYS ICEPAK software and SpaceClaim software. SpaceClaim helps in building CAD models for CFD analysis and converts them into CAD shapes. The course covers various aspects such as physics of the problem, thoughts on simulation method, problem setup and boundary conditions, visualization to quantitative post-processing, results, and meshing of geometry. 

The highlights

  • 100% Online learning

  • Free demo session available 

  • Flexible course fees

  • Guaranteed course certification will be given

  • 12 weeks course duration 

  • Certificate provided by Skill Lync 

Program offerings

  • Individual video support
  • Video lectures
  • Dedicated support engineer

Course and certificate fees

The course fee is as per three different plans that are given below:

  • The candidates need to make a fee payment of Rs. 7000 per month for accessing the programme of 3 months. This will be a Basic plan.

  • The candidates need to make a fee payment of Rs. 10000 per month to access the programme of 3 months. This will be a Pro plan. 

  • The candidates need to pay a fee of Rs. 15000 per month to access the programme for a lifetime. This is a premium plan.

Fee details for Electronic Cooling Simulations using ANSYS ICEPAK course

Particulars

Amount (in Rs) - per month payment

Basic - this is a 2 months access

Rs.7000/-

Pro - this is a 4 months access

Rs.10000/- 

Premium - lifetime access programme 

Rs.15000/-

certificate availability

Yes

certificate providing authority

Skill Lync

Who it is for

The Electronic cooling simulations using the ANSYS ICEPAK programme is ideally meant for:

  • Manufacturing engineers

  • Design engineers

  • Professionals who are engineers but are working currently in a non-CFD area and aspire to pursue CFD domain

  • Students who are keen and interested in Fluid mechanics and Thermal system 

  • A student who is currently studying in MS or MTech or a Non-CFD field 

  • Students who aspire to learn and work in the field of CFD 

Eligibility criteria

Work experience

Candidates applying for this programme can be either Electronics engineer, Electrical engineer, or Mechanical engineer

Education

Candidates applying for this programme must have a knowledge of fluid dynamics and heat transfer will be beneficial. 

*Note- The students should have access to ANSYS ICEPAK 

Certification Qualifying Details

Skill Lync will award a course certificate for Electronic Cooling Simulations using ANSYS ICEPAK course to those participants who have successfully completed the course. The top five percent of the class will be awarded a merit certificate.

What you will learn

Knowledge of electronics

As the Electronic Cooling Simulations using ANSYS ICEPAK course by Skill-Lync programme wraps, candidates will learn a series of areas that are given below: 

  • The candidates will be able to understand the heat transfer in electrical and electronics cooling

  • They will learn how to build thermal models of electronic devices with ICEPAK primitive shapes.

  • They will be able to acknowledge the use of different meshing techniques

  • They will grasp the basics of natural convections

  • They will be able to understand the uses of the heat sink

  • They will gain expertise in the subject of ANSYS ICEPAK

  • They will be able to understand the user input properties and parameters

  • Participants will be able to learn to analyze transient simulations

The syllabus

Week 1 : Introduction to electronics cooling

  • Thermal problems and challenges in electrical and electronics
  • When to do thermal analysis
  • Basics of heat transfer in electronics
  • Analogy - electrical vs. thermal
  • Thermal resistance and capacitance
  • Thermal management at different levels – component/chip/package level, board level, and system level
  • Different components in electronics
  • Process of solving thermal issue using ICEPAK
  • Most influential factors in thermal management of electronics
  • Overview of Ansys ICEPAK (Software introduction)

Week 2 : ICEPAK Model Building

  • Thermal simulation approach
  • Different primitives and compound objects in ICEPAK with their uses in the thermal model
  • Building the first project in ICEPAK
  • Geometry creation using ICEPAK to capture geometric information, material properties, and boundary conditions
  • Priorities of objects
  • Setting up the first problem
  • Meshing
  • Solving the first problem
  • Checking the convergence
  • Post-processing and interpretation of results

Week 3 : Meshing Techniques

  • Conformal meshing
  • Non- conformal meshing
  • Cold-plate model with non-conformal meshing
  • Zero slack with non-conformal meshing
  • Multi-level meshing
  • Mesh and model enhancement exercise
  • Global refinement for a hex-dominant mesh
  • Best practices for meshing complex geometries
  • Hands-on meshing examples and home works

Week 4 : Natural Convection

  • Basics of buoyancy effect

  • Basics of natural convections

  • Compare design alternatives

  • Design of a thermal system for best use of natural convections

Week 5 : Forced convection

  • Hands-on examples and homework

  • Choose a pump, fan, fluid mover to perform adequate fluid flow rate

  • Uses of the heat sink

  • Basics of forced convections

  • Understand heat pipes modeling and nested non-conformal meshing

Week 6 : Heat generation

  • Analyze trace heating in PCB in electronics

  • Perform board-level electrothermal coupling

  • Analyze heat generation due to Joule heating in electronic and electrical device

  • Hands-on examples and homework

  • Pcb modeling: compact and detailed modeling

Week 7 : Cad imports

  • Cad and ecad import options within icepak

  • Hands-on examples and homework

  • Design modeler/SpaceClaim

  • Translation of mcad geometry to icepak native geometry

Week 8 : Radiation modeling

  • Solar radiation / flux calculator

  • Different radiation models in icepak

  • Hands-on examples and homework

  • When to include a radiation model (t^4)

  • User input properties and parameters

Week 9 : Post-processing

  • Contours

  • Section planes

  • Various post-processing methods and plots

  • Streamlines

  • Hands-on examples and homework

  • Reporting results

  • Vector plots

Week 10 : Advanced simulations

  • Use of advanced methods in projects

  • Analyze transient simulations

  • Hands-on examples and homework

  • Understand the zoom-in modeling approach in icepak

Week 11 : Macros

  • Create bonding wires

  • Jedec test chambers - natural convection and forced convection

  • Pcb

  • Detailed heat sink

  • Datacenter components

Week 12 : Optimization

  • Function reporting and plotting

  • Defining design variables and a parametric study in icepak

  • When to use optimization

  • Define parametric runs and assign primary functions

  • Setting up & running trials

Admission details


Filling the form

Candidates need to follow the admission steps that are given below:

Step 1: Visit the official URL for the course.

Step 2: The option to enrol will be available on the webpage. Select that option.

Step 3: Candidates can choose the course plan they wish to register for.

Step 4: They have to fill in the details asked for to proceed further.

Step 5: After filling in the details, candidates need to make the fee payment in order to get the access link of the programme. 

How it helps

The Electronic Cooling Simulations using ANSYS ICEPAK course has been structured by industry experts to provide the learner's knowledge about electronic cooling simulations. Participants will be given industry-relevant projects to work on, tools, and software to practice upon. The experience and knowledge that they will get by working on the projects and software will set them and give them an advantage over others in the industry. Online course delivery will make the learning process easier for the participants. 

They can maintain a flexible learning schedule. They will be given email, telephone, WhatsApp support in case of any doubts or queries through the course. 

Course certificate that is given upon completion can be added to the resume making it more valuable. It can also be shared on various platforms to invite more job opportunities. They can link their technical projects as well to display their skills and capabilities.  It will also strengthen the portfolio of the participants for getting better grants and scholarship opportunities for MS Admits. It will expand their prospects in Research & Development and for higher profile jobs in electrical and electronic industries. 

They will be given placement assistance through resume building and interview preparation. Student success team access will also be given to ensure placements.

FAQs

Who are the course instructors?

The course instructors for this course are industry experts working with Fortune 500.

What will be the learning process?

Participants will be given access to the course material and assignments every week.

How will the doubts be solved?

Doubts can be solved through videoconferencing, WhatsApp support, and individual online sessions and also in person. They can be solved by the dedicated support engineer assigned to the participants to walk them through their problem areas and clarify any doubts that may arise.

How can I find this programme to be different from other colleges?

The courses are designed in consultation with industry experts. It gives the participants an opportunity to implement their learning and work on projects that will give them practical experience as well.

What is the real world application of the tools and techniques learned?

Some of the real-world applications of this course are a thermal simulation of heat generation in electrical components due to joule losses, Pcb thermal simulations, conduction, radiation and force, and natural convections.

Which companies use this technique?

Some of the companies that make use of these tools include Schneider Electric, Intel, Cisco, Apple, Altair, L&T, NVIDIA, ABB, Philips, and many more.

Are demo sessions given?

Yes, candidates are given a demo session to help them understand what is included in the course and how they will benefit, from an experienced consultant.

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