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Quick Facts

Medium Of InstructionsMode Of LearningMode Of Delivery
EnglishSelf StudyVideo and Text Based

Important dates

Course Commencement Date

Start Date : 20 Jan, 2025

End Date : 11 Apr, 2025

Enrollment Date

End Date : 27 Jan, 2025

Certificate Exam Date

Start Date : 27 Apr, 2025

Other

End Date : 14 Feb, 2025

Courses and Certificate Fees

Fees InformationsCertificate AvailabilityCertificate Providing Authority
INR 1000yesIISc Bangalore

The fees for the course Basics of Semiconductor Microwave Devices is -

HeadAmount in INR
Exam feesRs. 1000

The Syllabus

  • Introduction to the course: perspective & historical overview, Applications of various RF devices today

  • Basics of heterojunctions and heterostructure physics, Basics of III-nitrides and polarization Schottky multipliers & varactors

  • Transferred Electron Devices: Gunn Diode, Avalanche Transit Devices: IMPATT

  • III-V MESFET: physics and transport, I-V, load line, transconductance, fabrication. Intro to JFOM

  • III-V HEMT/MODFET – physics, modulation doping & the formation of 2DEG, breakdown, gain, traps, dispersion.

  • p-HEMT, recess gate, field-plate, power cell, multi-finger devices, fabrication

  • GaN HEMTs – benefits of WBG, various aspects of GaN RF HEMT such as substrate, processing, dispersion & virtual gate, leakage, stack design, compensation doping

  • Basics of RF CMOS;LDMOS – device physics, transport, breakdown, On resistance, snapback

  • LDMOS - layout & design, bond pad manifold, frequency aspects, the concept of RESURF

  • Bipolar devices for RF: working of HBT, Early Effect, Kirk Effect, Gain, Common Emitter & Common Base mode, small-signal model

  • Bipolar devices: base design, collector design, emitter ballast, SiGe bipolar, FET vs bipolar for RF, fabrication

  • Microwave concepts for devices and packaging: S-parameters & 2-port analysis, concept of impedance, Intro to Smith chart, de-embedding parasitics, derivation of cut-off frequencies and MAG/MSG, Transmission lines & waveguides, concept of impedance matching, Basics of RF device packaging and thermal management

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